and are proven products routinely used in semiconductors production. Silicon can reliability be converted to n-doping or p-doping by our superior control of the deposition process utilizing and ,
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The resulting electrical properties are very uniform and results in higher yields that other dopant diffusion processes can not match, particularly for larger wafer sizes. Many users obtain less silicon damage by using Ä¢¹½Ó°ÊÓtv°æ’s superior dopant system.
Micro machining (MEMS) has found Ä¢¹½Ó°ÊÓtv°æ diffusion sources to be a superior fit for their requirements and is using them to make sensors, printer heads, and many other MEMS devices.
Ä¢¹½Ó°ÊÓtv°æ’sÌý and are safe to use and does not require the use of explosive, toxic, or hazardous gases. No toxic off-gases are produced during the deposition.
Our and planar diffusion sources offer a superior dopant system for safe, cost effective, and reliable doping of silicon wafers. Combined with process quality yields, their safe processing, and non hazardous nature, many foundries have converted to using these solid sources.